|
EPOXIES
For all electronic applications
|
| PART
NO.
|
VISCOSITY
|
APPLICATION
|
| High
Strength |
| ER1001
|
High
|
Thixotropy
paste formulation for use on vertical surface where stay in
place adhesion is required. |
| ER1002
|
Medium
|
Moderate
thixotropy suitable for application with stay in place adhesion
is required. |
| ER1003
|
Low
|
Syrup
like consistency suitable for application requiring a thin glue
line and self-leveling characteristics. |
| General
Purpose |
| ER1100
|
19,000
cps |
Use
to bond steel, ceramic and dissimilar products. |
| Thermally
Conductive |
| ER1210
|
60,000
cps |
Two
part, thermally conductive suitable for PCB and power supplies.
|
| Encapsulating
Resin |
| ER2020
|
Low
|
Resin
system designed for the potting and encapsulation of miniaturized
electronic components. Moisture resistant. |
| ER2045
|
Very
Low |
General
purpose epoxy resin system for potting and encapsulation and
impregnation. This unique polymer cures to a glossy, bubble-free
casting impervious to moisture, chemicals and solvents.
|
| ER2060
|
Medium
|
Recommended
for the encapsulation and potting coils, capacitors, chokes,
and other electronic assembly applications. |
